Optoelectronic circuit having one or more double-sided substrates

ABSTRACT

An optoelectronic circuit having a substantially planar double-sided substrate, each side of which has a respective plurality of electrically conducting tracks and a respective plurality of planar optical waveguides. The substrate also has at least one via crossing the substrate in a manner that can be used to establish an optical path across the substrate, e.g., between optical waveguides located on different sides thereof. In an example embodiment, the electrically conducting tracks and planar optical waveguides are configured to operatively connect various optoelectronic devices and auxiliary electrical circuits attached to the two sides of the substrate using hybrid-integration technologies. In some embodiments, two or more of such double-sided substrates can be stacked and optically and electrically interconnected to create an integrated three-dimensional assembly.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.15/426,729, filed 2017 Feb. 7, and entitled “OPTOELECTRONIC CIRCUITHAVING ONE OR MORE DOUBLE-SIDED SUBSTRATES,” which is incorporatedherein by reference in its entirety.

BACKGROUND Field

The present disclosure relates to optical communication equipment and,more specifically but not exclusively, to an optoelectronic circuithaving one or more double-sided substrates.

Description of the Related Art

This section introduces aspects that may help facilitate a betterunderstanding of the disclosure. Accordingly, the statements of thissection are to be read in this light and are not to be understood asadmissions about what is in the prior art or what is not in the priorart.

An optoelectronic device can operate on both light and electricalcurrents (voltages) and may include one or more of: (i) an electricallydriven light source, such as a laser diode; (ii) an optical amplifier;(iii) an optical-to-electrical converter, such as a photodiode; and (iv)an optoelectronic component that can control the propagation and/orcertain properties of light, such as an optical modulator or a switch.The corresponding optoelectronic circuit may additionally include one ormore optical elements and/or one or more electronic components thatenable the use of the circuit's optoelectronic devices in a mannerconsistent with the circuit's intended function.

Different hybrid-integration technologies can be used to combine various(such as the above-mentioned) components of an optoelectronic circuitinto a practically useful integrated circuit, package, and/or assembly.While each of these technologies may offer significant respectivebenefits and/or advantages in certain types of applications, hybridintegration continues to evolve by providing more-narrowly tailoredsolutions to specific segments of the market. For example, severalproduct-specific factors typically need to be considered before the mostappropriate integration method can be selected or developed.

SUMMARY OF SOME SPECIFIC EMBODIMENTS

Disclosed herein are various embodiments of an optoelectronic circuithaving a substantially planar double-sided substrate, each side of whichhas a respective plurality of electrically conducting tracks and arespective plurality of planar optical waveguides. The substrate mayalso have at least one via crossing the substrate in a manner that canbe used to establish an optical path across the substrate, e.g., betweenoptical waveguides located on different sides thereof. In an exampleembodiment, the electrically conducting tracks and planar opticalwaveguides are configured to operatively connect various optoelectronicdevices and auxiliary electrical circuits attached to the two sides ofthe substrate using hybrid integration.

In some embodiments, two or more of such double-sided substrates can bestacked and optically and electrically interconnected to create anintegrated three-dimensional assembly.

The disclosed optoelectronic circuits may advantageously have a higherdensity of optical/electrical components and shorter optical andelectrical interconnections than typical functionally comparableconventional circuits. These and other pertinent characteristics of thedisclosed optoelectronic circuits can beneficially be used, e.g., toreduce optical and/or electrical losses, decrease the form factor, andimprove the functionality of the corresponding products.

According to one embodiment, provided is an apparatus comprising: aplanar substrate having opposing first and second surfaces; a firstplanar optical waveguide located at the first surface; a second planaroptical waveguide located at the second surface; a first optoelectronicdevice located at the first surface; and a second optoelectronic devicelocated at the second surface; and wherein the planar substrate has avia crossing said substrate and configured to optically connect thefirst planar optical waveguide and the second planar optical waveguide.

According to another embodiment, provided is an apparatus comprising: astack of two or more planar substrates, each having respective opposingfirst and second surfaces and a respective planar optical waveguidelocated at one of said first and second surfaces thereof; and whereinthe respective planar optical waveguides of two of the two or moreplanar substrates are optically connected via a respective optical paththat passes through at least one via crossing a respective substrate ofthe two or more planar substrates of the stack.

BRIEF DESCRIPTION OF THE DRAWINGS

Other aspects, features, and benefits of various disclosed embodimentswill become more fully apparent, by way of example, from the followingdetailed description and the accompanying drawings, in which:

FIG. 1 shows a schematic side view of an optoelectronic circuitaccording to an embodiment;

FIG. 2 shows a schematic side view of a stack of planar lightwavecircuits that can be used in the optoelectronic circuit of FIG. 1according to an embodiment;

FIG. 3 shows a schematic side view of a stack of planar lightwavecircuits according to an alternative embodiment; and

FIG. 4 shows a schematic side view of a planar lightwave circuitaccording to an alternative embodiment.

DETAILED DESCRIPTION

FIG. 1 shows a schematic side view of an optoelectronic circuit 100according to an embodiment. Optoelectronic circuit 100 comprises anelectrical circuit 110, planar lightwave circuits (PLCs) 140 ₁ and 140₂, and a heat sink 190. Circuits 110, 140 ₁, and 140 ₂ and heat sink 190are attached to one another, e.g., as indicated in FIG. 1, to form amechanically robust stack, package, and/or assembly. A person ofordinary skill in the art will understand that, in an alternativeembodiment, optoelectronic circuit 100 may include more than oneelectrical circuit that is similar to electrical circuit 110 and/or adifferent number of PLCs, each similar to a PLC 140.

Electrical circuit 110 and PLCs 140 ₁ and 140 ₂ are electricallyinterconnected as described in more detail below. Electrical circuit 110is further electrically connected to one or more external electricalcircuits and/or devices using a plurality of electrical leads (e.g.,wires) 102, only one of which is explicitly shown in FIG. 1 forillustration purposes. In an example embodiment, PLCs 140 ₁ and 140 ₂are electrically connected to the external electrical circuits/devicesthrough electrical circuit 110 and might not have any direct externalelectrical connections that bypass electrical circuit 110.

PLCs 140 ₁ and 140 ₂ are optically interconnected as described in moredetail below. PLC 140 ₁ is further optically connected to one or moreexternal optical and/or optoelectronic circuits/devices using one ormore optical fibers 132, only one of which is explicitly shown in FIG. 1for illustration purposes. In an example embodiment, PLC 140 ₂ isoptically connected to the external optical and/or optoelectroniccircuits/devices through PLC 140 ₁ and might not have any directexternal optical connections that bypass PLC 140 ₁.

Heat sink 190 can be optional and generally operates to help maintainthe temperatures of electrical circuit 110 and PLCs 140 ₁ and 140 ₂within respective acceptable temperature ranges. In an exampleembodiment, heat sink 190 may be thermally coupled to electrical circuit110 and PLCs 140 ₁ and 140 ₂, e.g., as indicated in FIG. 1, using one ormore thermally conducting couplers 188. Heat sink 190 may also include amicrofluidic channel 192 and a plurality of fins 194 configured tofacilitate heat dissipation and removal from optoelectronic circuit 100as known in the pertinent art. In an alternative embodiment, anadditional heat sink (not explicitly shown in FIG. 1) analogous to heatsink 190 can be placed next to electrical circuit 110.

In an example embodiment, electrical circuit 110 comprises asubstantially planar substrate 106 whose lateral dimensions (e.g.,length and width) are larger than its thickness do indicated in FIG. 1.The opposing surfaces of substrate 106 have patterned electricallyconducting (e.g., metal) layers 104 and 108, respectively. Someconducting tracks of layers 104 and 108 are electrically connected toone another using a plurality of electrical vias 105. Layers 104 and 108have conducting-track patterns (not explicitly shown in FIG. 1) that areconfigured to provide electrical connections between various portions ofsubstrate 106 in a manner that enables proper operation of (i) variouselectronic integrated circuits (e.g., chips or dies) 112 directlyattached and electrically connected to layer 104 and (ii) the PLCs 140 ₁and 140 ₂, which are electrically connected to layer 108.

For illustration purposes and without any implied limitations, substrate106 is shown in FIG. 1 as having four electronic integrated circuits 112₁-112 ₄ attached to layer 104. Although electronic integrated circuits112 ₁-112 ₄ are illustratively shown in FIG. 1 as being attached tolayer 104 using ball grid arrays 111 ₁-111 ₄, respectively, alternativesurface-mount technologies can also be used in alternative embodiments.In an alternative embodiment, substrate 106 may have a different (fromfour) number of electronic integrated circuits 112 attached to layer104. In various embodiments, electronic integrated circuits 112 mayinclude, e.g., one or more of the following: (i) a digital signalprocessor; (ii) a memory; (iii) a microcontroller; (iv) ananalog-to-digital converter; (v) a digital-to-analog converter; and (vi)a power converter. In some embodiments, substrate 106 may haveadditional electronic integrated circuits 112 directly attached to layer108.

PLC 140 ₁ comprises a substantially planar (e.g., semiconductor)substrate 126 ₁ whose lateral dimensions (e.g., length and width) arelarger than its thickness d₁ indicated in FIG. 1. The opposing surfacesof substrate 126 ₁ have patterned electrically conducting (e.g., metal)layers 124 ₁ and 128 ₁, respectively. Some conducting tracks of layers124 ₁ and 128 ₁ are electrically connected to one another using aplurality of electrical vias 125. Layer 124 ₁ is further electricallyconnected to layer 108 of electrical circuit 110 using a plurality ofsolder balls 116. Layer 128 ₁ is further electrically connected to anelectrically conducting layer 124 ₂ of PLC 140 ₂ using a plurality ofsolder balls 156.

Substrate 126 ₁ also has planar waveguide layers 134 ₁ and 138 ₁ thatare adjacent to the surfaces having electrically conducting layers 124 ₁and 128 ₁, respectively. Each of waveguide layers 134 ₁ and 138 ₁ ispatterned to create a respective plurality of (e.g., ridge) waveguidesconfigured to provide optical paths/connections between differentportions of substrate 126 ₁ in a manner that enables proper operation ofvarious optoelectronic devices 144 attached to that substrate. Invarious embodiments, optoelectronic devices 144 may include, e.g., oneor more of the following: (i) a photodiode; (ii) an optical amplifier;(iii) an optical modulator; (iv) an optical switch; and (v) a laserdiode. Each of optoelectronic devices 144 is electrically connected toone or both of electrically conducting layers 124 ₁ and 128 ₁ to receiveand/or output the corresponding electrical signals used or generated bythat optoelectronic device during its operation.

In an example embodiment, proper operation of optoelectronic devices 144of PLC 140 ₁ is supported by auxiliary electrical circuits 148 that arefixedly attached and electrically connected to electrically conductinglayers 124 ₁ and/or 128 ₁. Each auxiliary electrical circuit 148 can beimplemented using a conventional packaged electronic IC, a die, or a setof discrete electrical elements. For illustration purposes, PLC 140 ₁ isshown in FIG. 1 as having five auxiliary electrical circuits 148(labeled 148 ₁-148 ₅). A person of ordinary skill in the art willunderstand that the number and type of optoelectronic devices 144 andthe number and type of auxiliary electrical circuits 148 used in PLC 140₁ depend on the intended function and/or application of that PLC and mayvary from embodiment to embodiment.

For example, optoelectronic device 144 ₁ may be a photodiode. Photodiode144 ₁ is electrically connected to layer 124 ₁ by way of solder bumps145. Photodiode 144 ₁ is optically coupled to a corresponding opticalwaveguide of layer 134 ₁ by way of a corresponding turning mirror 146.Mirror 146 has a slanted reflective surface that changes the propagationdirection of the light received from the corresponding optical waveguideto cause the reflected light to impinge onto a photosensitive area ofphotodiode 144 ₁. The electrical signal generated by photodiode 144 ₁ inresponse to the received light is then transferred, e.g., as indicatedin FIG. 1, to a transimpedance amplifier 148 ₁ that is fixedly attachedand electrically connected to electrically conducting layer 128 ₁.

As another example, optoelectronic device 144 ₂ may be an opticalmodulator. Optical modulator 144 ₂ modulates light in response to one ormore electrical signals applied to it, e.g., as indicated in FIG. 1, bya driver circuit 148 ₂ that is fixedly attached and electricallyconnected to electrically conducting layer 128 ₁. Optical modulator 144₂ is optically coupled to the corresponding optical waveguides of layer134 ₁ using the corresponding ball lenses 150. More specifically, afirst pair of ball lenses 150 is configured to couple light from a firstoptical waveguide of layer 134 ₁ into optical modulator 144 ₂, where thereceived light may be phase- and/or amplitude-modulated. A second pairof ball lenses 150 then operates to couple the resulting modulated lightinto a second optical waveguide of layer 134 ₁.

As yet another example, optoelectronic device 144 ₃ may be a laserdiode. Laser diode 144 ₃ generates light in response to one or moreelectrical signals applied to it, e.g., as indicated in FIG. 1, by adriver circuit 148 ₄ that is fixedly attached and electrically connectedto electrically conducting layer 128 ₁. Laser diode 144 ₃ is opticallycoupled to the corresponding optical waveguide of layer 134 ₁ using acorresponding pair of ball lenses 150. In the shown example, laser diode144 ₃ and the corresponding pair of ball lenses 150 are locallyencapsulated using a suitable (e.g., polymeric) filler 162 and aretaining bracket or cap 164. In an alternative embodiment, localencapsulation can be implemented by bonding a window onto a seal ringover the circuit components that are being encapsulated.

PLC 140 ₂ is similar to PLC 140 ₁, and the generally analogous elementsof the two PLCs are labeled in FIG. 1 using the same numerical labels(with the exception of the subscripts). In an example embodiment, PLC140 ₂ comprises a substantially planar substrate 126 ₂, patternedelectrically conducting layers 124 ₂ and 128 ₂, patterned planarwaveguide layers 134 ₂ and 138 ₂, a respective plurality of electricalvias 125, a respective plurality of ball lenses 150, optoelectronicdevices 144 ₄-144 ₇, and auxiliary electrical circuits 148 ₆-148 ₁₁.Substrate 126 ₂ has lateral dimensions that are larger than itsthickness d₂ indicated in FIG. 1. Optoelectronic devices 144 ₄-144 ₇ mayinclude, e.g., one or more of the following: (i) a photodiode; (ii) anoptical modulator; (iii) an optical amplifier; (iv) an optical switch;and (v) a laser diode. Auxiliary electrical circuits 148 ₆-148 ₁₁ mayinclude, e.g., one or more of the following: (i) an amplifier; (ii) adriver circuit; and (iii) a control circuit. A person of ordinary skillin the art will understand that the number and type of optoelectronicdevices 144 and the number and type of auxiliary electrical circuits 148used in PLC 140 ₂ depend on the intended function and/or application ofthat PLC and may vary from embodiment to embodiment.

As indicated in FIG. 1, PLCs 140 ₁ and 140 ₂ are arranged in a stack inwhich optical signals can be transferred between various waveguides ofplanar waveguide layers 134 ₁, 134 ₂, 138 ₁, and 138 ₂ by way ofthrough-substrate vias 170. For illustration purposes and without anyimplied limitations, only three such vias (labeled 170 ₁-170 ₃) areshown in FIG. 1. More specifically, PLC 140 ₁ is shown as having the via170 ₁. PLC 140 ₂ is shown as having the vias 170 ₂ and 170 ₃. Ingeneral, any desired number (that is feasible from the engineeringviewpoint) of vias 170 can be incorporated into PLCs 140 ₁ and 140 ₂ toprovide optical paths for optical-signal transfer between variouswaveguides of planar waveguide layers 134 ₁, 134 ₂, 138 ₁, and 138 ₂.

For example, the vias 170 ₁ and 170 ₂ are aligned with one another tocreate an optical path between an optical waveguide of planar waveguidelayer 134 ₁ and an optical waveguide of planar waveguide layer 138 ₂.Two slanted mirrors 146 inserted at the opposing ends of the vias 170 ₁and 170 ₂ as indicated in FIG. 1 appropriately change the propagationdirection of light from being substantially orthogonal to the mainplanes of PLCs 140 ₁ and 140 ₂ to being parallel to those planes, orvice versa. As a result, an optical signal can cross substrates 126 ₁and 126 ₂ by way of the optical path created by the vias 170 ₁ and 170 ₂and be coupled in and out of the corresponding optical waveguides of theplanar waveguide layers 134 ₁ and 138 ₂. In some embodiments, slantedmirror 146 can be augmented by an appropriate lens (see, e.g., FIG. 2).

The via 170 ₃ is configured to create an optical path between an opticalwaveguide of planar waveguide layer 134 ₂ and an optical waveguide ofplanar waveguide layer 138 ₂. Two slanted mirrors 146 inserted at theopposing ends of the via 170 ₃ as indicated in FIG. 1 appropriatelychange the propagation direction of light from being substantiallyorthogonal to the main plane of PLCs 140 ₂ to being parallel to thatplane, or vice versa. As a result, an optical signal can cross substrate126 ₂ by way of the optical path created by the via 170 ₃ and be coupledin and out of the corresponding optical waveguides of the planarwaveguide layers 134 ₂ and 138 ₂.

As used herein, the term “via” refers to an opening (e.g., a hole orchannel) that passes completely through the corresponding substrate(such as a wafer or die). The cross-sectional shape of the opening mayor may not be uniform along the length of the via. The via can befilled, partially of completely, with one or more filler materials. Avia can be designed and configured for providing an optical connection,an electrical connection, or both. For example, a via configured toprovide an electrical connection is typically filled with metal, whichis not optically transparent. In contrast, a via configured to providean optical connection is typically unfilled or only partially filledand, as such, is optically transparent. In some embodiments, such a viamay be filled with an optically transparent material, such as glass orsilicon oxide.

In some embodiments, one or both of substrates 126 ₁ and 126 ₂ may haveembedded therein one or more passive electrical components, such asresistors, capacitors, and inductors, that are electrically connected toconducting tracks of one or both of the corresponding electricallyconducting layers 124 and 128 using the corresponding electrical vias125.

In some embodiments, one or both of substrates 126 ₁ and 126 ₂ may havetherein one or more microfluidic channels 182 for improved heat removalfrom PLCs 140 ₁ and 140 ₂. For illustration purposes, substrate 126 ₂ isshown in FIG. 1 as having four microfluidic channels 182 located inproximity to optoelectronic device 144 ₆. A person of ordinary skill inthe art will understand that, in an alternative embodiment, a differentconfiguration of microfluidic channels 182 can similarly be used.

FIG. 2 shows a schematic side view of a stack 200 of PLCs that can beused in optoelectronic circuit 100 (FIG. 1) according to an embodiment.For illustration purposes, stack 200 is shown in FIG. 2 as includingPLCs 140 ₁-140 ₃. For clarity of depiction, some of the constituentlayers of PLCs 140 ₁-140 ₃ are not explicitly shown in FIG. 2. In an aalternative embodiment, stack 200 may have a different (from three)number of PLC s.

PLC 140 ₁ comprises an optical waveguide 238 ₁ that is a part of planarwaveguide layer 138 ₁ (also see FIG. 1). PLC 140 ₂ comprises an opticalwaveguide 238 ₂ that is a part of planar waveguide layer 138 ₂ (also seeFIG. 1). PLCs 140 ₁-140 ₃ have vias 270 ₁-270 ₃, respectively, thatcreate an optical path that enables an optical signal 202 to betransferred, e.g., as indicated in FIG. 2, from optical waveguide 238 ₂of PLC 140 ₂ to optical waveguide 238 ₁ of PLC 140 ₁.

Each of the vias 270 ₁-270 ₃ provides an opening in the respective oneof substrates 126 ₁-126 ₃. The longitudinal axes of the vias 270 ₁-270 ₃can be aligned (made collinear) with one another, e.g., as indicated inFIG. 2, using alignment grooves 204 and alignment balls 206. The via 270₂ has an optical prism 210 ₂ positioned therein in a manner that causesa facet 212 ₂ of that optical prism to function as a turning mirror forthe light that exits optical waveguide 238 ₂. A lens 214 ₂ attached toanother facet of optical prism 210 ₂ is then used to collimate the lightof optical signal 202 and direct a resulting collimated optical beam 220through the via 270 ₂ of substrate 126 ₂ toward PLCs 140 ₃ and 140 ₁.

Optical beam 220 first passes through the via 270 ₃, thereby crossingsubstrate 126 ₃ of PLCs 140 ₃ as indicated in FIG. 2. Optical beam 220then impinges onto an optical prism 210 ₁ positioned in the via 270 ₁ ofsubstrate 126 ₁. A facet 212 ₁ of optical prism 210 ₁ operates as aturning mirror that causes the light of optical beam 220 to be directedtoward optical waveguide 238 ₁. A lens 214 ₁ attached to another facetof optical prism 210 ₁ is used to compress optical beam 220 for bettercoupling the light thereof into optical waveguide 238 ₁. As a result,optical signal 202 can be transferred from optical waveguide 238 ₂ ofPLC 140 ₂ to optical waveguide 238 ₁ of PLC 140 ₁ with relatively lowoptical losses.

A person of ordinary skill in the art will understand that arrangementsof turning mirrors and lenses similar to that shown in FIG. 2 can beused to create one or more additional optical paths for transferringoptical signals between optical waveguides located in any pair of planarwaveguide layers of PLCs 140 ₁-140 ₃. For example, some of such opticalpaths can be used to transfer optical signals between the opticalwaveguides located in planar waveguide layers 134 and 138, respectively,of the same PLC 140 (see, e.g., the via 170 ₃ shown in FIG. 1). Some ofsuch optical paths can be used to transfer optical signals between theoptical waveguides located in respective planar waveguide layers ofdifferent PLCs 140 (see, e.g., the vias 170 ₁ and 170 ₂ shown in FIG.1). In particular, vias, turning mirrors, and lenses can be arranged tocreate optical paths for transferring optical signals as follows: (i)between an optical waveguide located in planar waveguide layer 134 ofone PLC 140 and an optical waveguide located in planar waveguide layer134 of another PLC 140; (ii) between an optical waveguide located inplanar waveguide layer 134 of one PLC 140 and an optical waveguidelocated in planar waveguide layer 138 of another PLC 140; and (iii)between an optical waveguide located in planar waveguide layer 138 ofone PLC 140 and an optical waveguide located in planar waveguide layer138 of another PLC 140.

In some alternative embodiments, stack 200 may have more than three PLCs140. In such embodiments, some of the optical paths for transferringoptical signals between different PLCs 140 of stack 200 may cross morethan one PLC 140 in a manner similar to that indicated in FIG. 2 for PLC140 ₃.

In some embodiments, some of the vias that provide optical connectionscan also be configured to additionally provide electrical connections.The via 270 ₃ shown in FIG. 2 is an example of such a dual-function(optical/electrical) via. More specifically, side walls of the via 270 ₃are coated with a film 272 of an electrically conducting material (e.g.,a metal) in a manner that causes the film to connect electricallyconducting layers 124 ₃ and 128 ₃ of PLC 140 ₃. At the same time, film272 is relatively thin, which causes it to leave a sufficient unfilledopening in the middle portion of the via 270 ₃ for optical beam 220 topass through unimpeded, e.g., as indicated in FIG. 2.

FIG. 3 shows a schematic side view of a stack 300 of two PLCs 140according to an alternative embodiment. For illustration purposes, stack300 is shown in FIG. 3 as including PLCs 140 ₁ and 140 ₂. For clarity ofdepiction, some of the constituent layers of PLCs 140 i-140 ₂ are notexplicitly shown in FIG. 3.

Stack 300 is generally analogous to stack 200 shown in FIG. 2 and isconstructed using many of the same structural and functional elements asstack 200. These elements are labeled in FIG. 3 using the same labels asin FIG. 2. The description of these elements is already provided abovein reference to FIG. 2 and is not repeated here. However, stack 300differs from stack 200 in that PLC 140 ₃ is not present in stack 300. Asa result, optical beam 220 in stack 300 crosses only one substrate,i.e., 126 ₂, by passing through the via 270 ₂ as indicated in FIG. 3.

FIG. 4 shows a schematic side view of PLC 140 ₂ according to analternative embodiment. In the shown embodiment, PLC 140 ₂ is astand-alone piece of equipment. For example, this particular embodimentcan be made by one party (e.g., a part supplier) and then sold toanother party (e.g., an assembly maker). The latter party can then usethe supplied PLC 140 ₂ along with other pertinent parts to assemble anembodiment of optoelectronic circuit 100 (see FIG. 1).

According to an example embodiment disclosed above in reference to FIGS.1-4, provided is an apparatus (e.g., 100, FIG. 1, or 140 ₂, FIG. 4)comprising: a substantially planar substrate (e.g., 126 ₂, FIG. 1)having opposing first and second surfaces; a first planar opticalwaveguide (e.g., part of 134 ₂, FIGS. 1, 4) located at the firstsurface; a second planar optical waveguide (e.g., part of 138 ₂, FIGS.1, 4) located at the second surface; a first optoelectronic device(e.g., 144 ₅, FIGS. 1, 4) located at the first surface; and a secondoptoelectronic device (e.g., 144 ₆, FIGS. 1, 4) located at the secondsurface; and wherein the substantially planar substrate has a via (e.g.,170 ₃, FIG. 1) crossing said substrate and configured to opticallyconnect the first planar optical waveguide and the second planar opticalwaveguide.

In some embodiments of the above apparatus, the apparatus furthercomprises: a first electrical circuit (e.g., 148 ₈, FIG. 1) located atthe first surface; and a second electrical circuit (e.g., 148 ₁₀,FIG. 1) located at the second surface; and wherein the first and secondelectrical circuits are electrically connected to support operation ofone or both of the first and second optoelectronic devices.

In some embodiments of any of the above apparatus, the first electricalcircuit comprises a first electronic controller connected to control thefirst optoelectronic device; and the second electrical circuit comprisesa second electronic controller connected to control the secondoptoelectronic device.

In some embodiments of any of the above apparatus, the first electricalcircuit comprises an electronic controller connected to control thesecond optoelectronic device; and the substantially planar substrate hasat least one electrical via (e.g., 125, FIG. 1) crossing said substrateand configured to electrically connect the first electrical circuit andthe second optoelectronic device.

In some embodiments of any of the above apparatus, at least one of thefirst and second electrical circuits comprises one or more of thefollowing: an electrical amplifier; a driver circuit; a control circuit;and a digital circuit.

In some embodiments of any of the above apparatus, the apparatus furthercomprises: a first ball grid array on the first surface thatelectrically connects the first electrical circuit to a plurality ofconducting tracks (e.g., 124 ₂, FIG. 1) on the first surface; and asecond ball grid array on the second surface that electrically connectsthe second electrical circuit to a plurality of conducting tracks (e.g.,128 ₂, FIG. 1) on the second surface.

In some embodiments of any of the above apparatus, at least one of thefirst and second optoelectronic devices comprises one or more of thefollowing: a photodiode; an optical amplifier; an optical modulator; anoptical switch; and a coherent light source.

In some embodiments of any of the above apparatus, the apparatus furthercomprises a first turning mirror (e.g., 146, FIG. 1) located at a firstend of the via and configured to direct light received from the firstplanar optical waveguide through the via in a direction substantially(e.g., within ±15 degrees) orthogonal to the substantially planarsubstrate.

In some embodiments of any of the above apparatus, the apparatus furthercomprises a second turning mirror (e.g., another 146 of 170 ₃, FIG. 1)located at an opposite second end of the via and configured to couplelight received from the first turning mirror into the second planaroptical waveguide by directing said light in a direction substantially(e.g., within ±15 degrees) parallel to the substantially planarsubstrate.

In some embodiments of any of the above apparatus, the firstoptoelectronic device is optically coupled to the first planar opticalwaveguide; the second optoelectronic device is optically coupled to thesecond planar optical waveguide; and light transmitted between the firstoptoelectronic device and the second optoelectronic device passesthrough the via.

In some embodiments of any of the above apparatus, the substantiallyplanar substrate has one or more microfluidic channels (e.g., 182, FIG.1).

In some embodiments of any of the above apparatus, the apparatus furthercomprises: at least one other optoelectronic device (e.g., 144 ₄,FIG. 1) located at the first surface; and at least one otheroptoelectronic device (e.g., 144 ₇, FIG. 1) located at the secondsurface.

In some embodiments of any of the above apparatus, the apparatus furthercomprises: at least one other electrical circuit (e.g., 148 ₇, FIG. 1)located at the first surface; and at least one other electrical circuit(e.g., 148 ₁₁, FIG. 1) located at the second surface; and wherein saidother electrical circuits are electrically connected to supportoperation of one or both of said other optoelectronic devices.

According to another example embodiment disclosed above in reference toFIGS. 1-4, provided is an apparatus (e.g., 100, FIG. 1; 200, FIG. 2; or300, FIG. 3) comprising: a stack (e.g., 200, FIG. 2; 300, FIG. 3) of twoor more substantially planar substrates (e.g., 126 i-126 ₂, FIG. 3, or126 ₁-126 ₃, FIG. 2), each having respective opposing first and secondsurfaces and a respective planar optical waveguide (e.g., 238, FIG. 2)located at one of said first and second surfaces thereof; and whereinthe respective planar optical waveguides of two of the two or moresubstantially planar substrates are optically connected via a respectiveoptical path that passes through at least one via (e.g., 270, FIGS. 2-3)crossing a respective substrate of the two or more substantially planarsubstrates of the stack.

In some embodiments of the above apparatus, the apparatus furthercomprises a first mirror (e.g., 212 ₂, FIG. 2) configured to directlight between an end of one of the respective planar optical waveguidesand the at least one via.

In some embodiments of any of the above apparatus, the apparatus furthercomprises a second mirror (e.g., 212 ₁, FIG. 2) configured to directlight between the at least one via and an end of another one of therespective planar optical waveguides.

In some embodiments of any of the above apparatus, the at least one viahas a metal film (e.g., 272, FIG. 2) on a wall thereof, the metal filmelectrically connecting the respective opposing first and secondsurfaces.

In some embodiments of any of the above apparatus, the stack includes: afirst substantially planar substrate (e.g., 126 ₂, FIG. 2) having afirst planar optical waveguide (e.g., 238 ₂, FIG. 2) located at asurface thereof and a first via (e.g., 270 ₂, FIG. 2) crossing the firstsubstantially planar substrate; and a second substantially planarsubstrate (e.g., 126 ₁, FIG. 2) having a second planar optical waveguide(e.g., 238 ₁, FIG. 2) located at a surface thereof; and wherein thefirst and second planar optical waveguides are optically connected viaan optical path (e.g., for 220, FIG. 2) that passes through the firstvia.

In some embodiments of any of the above apparatus, the stack furtherincludes a third substantially planar substrate (e.g., 126 ₃, FIG. 2)having a second via (e.g., 270 ₃, FIG. 2) crossing the thirdsubstantially planar substrate; and wherein the optical path furtherpasses through the second via.

In some embodiments of any of the above apparatus, the stack includes: afirst substantially planar substrate (e.g., 126 ₂, FIG. 2) having afirst planar optical waveguide (e.g., 238 ₂, FIG. 2) located at asurface thereof; a second substantially planar substrate (e.g., 126 ₁,FIG. 2) having a second planar optical waveguide (e.g., 238 ₁, FIG. 2)located at a surface thereof; and a third substantially planar substrate(e.g., 126 ₃, FIG. 2) located between the first and second substantiallyplanar substrates in the stack, the third substantially planar substratehaving an via (e.g., 270 ₃, FIG. 2) crossing said third substantiallyplanar substrate; and wherein the first and second planar opticalwaveguides are optically connected via an optical path (e.g., for 220,FIG. 2) that passes through the via.

While this disclosure includes references to illustrative embodiments,this specification is not intended to be construed in a limiting sense.Various modifications of the described embodiments, as well as otherembodiments within the scope of the disclosure, which are apparent topersons skilled in the art to which the disclosure pertains are deemedto lie within the principle and scope of the disclosure, e.g., asexpressed in the following claims.

Unless explicitly stated otherwise, each numerical value and rangeshould be interpreted as being approximate as if the word “about” or“approximately” preceded the value or range.

It will be further understood that various changes in the details,materials, and arrangements of the parts which have been described andillustrated in order to explain the nature of this disclosure may bemade by those skilled in the art without departing from the scope of thedisclosure, e.g., as expressed in the following claims.

Reference herein to “one embodiment” or “an embodiment” means that aparticular feature, structure, or characteristic described in connectionwith the embodiment can be included in at least one embodiment of thedisclosure. The appearances of the phrase “in one embodiment” in variousplaces in the specification are not necessarily all referring to thesame embodiment, nor are separate or alternative embodiments necessarilymutually exclusive of other embodiments. The same applies to the term“implementation.”

Throughout the detailed description, the drawings, which are not toscale, are illustrative only and are used in order to explain, ratherthan limit the disclosure. The use of terms such as height, length,width, top, bottom, is strictly to facilitate the description of theembodiments and is not intended to limit the embodiments to a specificorientation. For example, height does not imply only a vertical riselimitation, but is used to identify one of the three dimensions of athree dimensional structure as shown in the figures. Such “height” wouldbe vertical where the substrates are horizontal but would be horizontalwhere the substrates are vertical, and so on. Similarly, while allfigures show the different layers as horizontal layers such orientationis for descriptive purpose only and not to be construed as a limitation.

Also for purposes of this description, the terms “couple,” “coupling,”“coupled,” “connect,” “connecting,” or “connected” refer to any mannerknown in the art or later developed in which energy is allowed to betransferred between two or more elements, and the interposition of oneor more additional elements is contemplated, although not required.Conversely, the terms “directly coupled,” “directly connected,” etc.,imply the absence of such additional elements.

The description and drawings merely illustrate the principles of thedisclosure. It will thus be appreciated that those of ordinary skill inthe art will be able to devise various arrangements that, although notexplicitly described or shown herein, embody the principles of thedisclosure and are included within its spirit and scope. Furthermore,all examples recited herein are principally intended expressly to beonly for pedagogical purposes to aid the reader in understanding theprinciples of the disclosure and the concepts contributed by theinventor(s) to furthering the art, and are to be construed as beingwithout limitation to such specifically recited examples and conditions.Moreover, all statements herein reciting principles, aspects, andembodiments of the disclosure, as well as specific examples thereof, areintended to encompass equivalents thereof.

What is claimed is:
 1. An apparatus comprising: a stack comprising firstand second planar substrates and a plurality of solder objects locatedbetween and connecting the first and second planar substrates, each ofthe first and second planar substrates having respective opposing firstand second surfaces, the first planar substrate having a first planaroptical waveguide located at one of said first and second surfaces ofthe first planar substrate and further having a first via crossing thefirst planar substrate, the second planar substrate having a secondplanar optical waveguide located at one of said first and secondsurfaces of the second planar substrate; a first optoelectronic devicelocated at said one of said first and second surfaces of the firstplanar substrate, the first optoelectronic device being opticallycoupled to the first planar optical waveguide; and a secondoptoelectronic device located at said one of said first and secondsurfaces of the second planar substrate, the second optoelectronicdevice being optically coupled to the second planar optical waveguide;wherein the first and second planar optical waveguides are opticallyconnected via an optical path that passes through the first via.
 2. Theapparatus of claim 1, further comprising a first mirror configured todirect light between an end of one of the first and second planaroptical waveguides and the first via.
 3. The apparatus of claim 2,further comprising a second mirror configured to direct light betweenthe first via and an end of another one of the first and second planaroptical waveguides.
 4. The apparatus of claim 1, wherein the first viahas a metal film on a wall thereof, the metal film electricallyconnecting the respective opposing first and second surfaces of thefirst planar substrate.
 5. The apparatus of claim 1, wherein the stackfurther comprises a third planar substrate having a second via crossingthe third planar substrate; and wherein the optical path further passesthrough the second via.
 6. The apparatus of claim 1, further comprising:a first packaged electronic integrated circuit located at said one ofsaid first and second surfaces of the first planar substrate or atanother one of said first and second surfaces of the first planarsubstrate, the first packaged electronic integrated circuit beingelectrically connected to the first optoelectronic device using one ormore conducting tracks on at least one of said first and second surfacesof the first planar substrate; and a second packaged electronicintegrated circuit located at said one of said first and second surfacesof the second planar substrate or at another one of said first andsecond surfaces of the second planar substrate, the second packagedelectronic integrated circuit being electrically connected to the secondoptoelectronic device using one or more conducting tracks on at leastone of said first and second surfaces of the second planar substrate. 7.The apparatus of claim 1, wherein the plurality of solder objectsinclude solder bumps.
 8. The apparatus of claim 1, wherein some of thesolder objects are in contact with alignment grooves on the substrates.9. An apparatus comprising: a stack comprising first, second, and thirdplanar substrates, the first planar substrate having a first planaroptical waveguide located at a surface thereof, the second planarsubstrate having a second planar optical waveguide located at a surfacethereof, the third planar substrate being located between the first andsecond planar substrates in the stack and having a via crossing saidthird planar substrate; a first optoelectronic device located at thesurface of the first planar substrate, the first optoelectronic devicebeing optically coupled to the first planar optical waveguide; and asecond optoelectronic device located at the surface of the second planarsubstrate, the second optoelectronic device being optically coupled tothe second planar optical waveguide; wherein the first and second planaroptical waveguides are optically connected via an optical path thatpasses through the via; and wherein the apparatus further comprises atleast one of: an optoelectronic device on one of opposing first andsecond surfaces of the third planar substrate; and a packaged electronicintegrated circuit on one of the opposing first and second surfaces ofthe third planar substrate, the packaged electronic integrated circuitbeing electrically connected to the third optoelectronic device.
 10. Anapparatus comprising: a stack comprising first and second planarsubstrates, the first planar substrate having a first planar opticalwaveguide located at a surface thereof and a first via crossing thefirst planar substrate, the second planar substrate having a secondplanar optical waveguide located at a surface thereof; and a firstoptoelectronic device located at the surface of the first planarsubstrate, the first optoelectronic device being optically coupled tothe first planar optical waveguide; a second optoelectronic devicelocated at the surface of the second planar substrate, the secondoptoelectronic device being optically coupled to the second planaroptical waveguide; a first packaged electronic integrated circuitlocated at the surface of the first planar substrate or at a respectiveopposing surface of the first planar substrate, the first packagedelectronic integrated circuit being electrically connected to the firstoptoelectronic device using one or both of conducting tracks on thesurface and the respective opposing surface, respectively, of the firstplanar substrate; and a second packaged electronic integrated circuitlocated at the surface of the second planar substrate or at a respectiveopposing surface of the second planar substrate, the second packagedelectronic integrated circuit being electrically connected to the secondoptoelectronic device using one or both of conducting tracks on thesurface and the respective opposing surface, respectively, of the secondplanar substrate; and wherein the first and second planar opticalwaveguides are optically connected via an optical path that passesthrough the first via.